Home > Copper Clad Laminates > Rogers AD255C DK2.55 Df0.0013 (0.020-0.125") Antenna Grade Laminate

Rogers AD255C Antenna Grade Laminate
Material:Rogers AD255C / Glass-Reinforced PTFE with ED/RTF Copper
MOQ:1 Sheet
Price:239-899 USD/Sheet
Packaging:Anti-static / Protective Packaging
Delivery Period:7-14 working days
Payment Method:T/T, Paypal
 

Rogers AD255C DK2.55 Df0.0013 (0.020-0.125") Antenna Grade Laminate


Brief Introduction

The AD Series antenna materials from Rogers Corporation are high-performance, specialty glass-reinforced PTFE-based laminates engineered for wireless antenna markets. AD255C provides controlled dielectric constant (2.55), low loss performance (Df 0.0013), and excellent passive intermodulation (PIM) performance. The woven glass reinforcement affords good circuit processability and enables high-yield circuit board fabrication.


Technical Features & Benefits

Glass-reinforced PTFE composite for excellent processability
Controlled dielectric constant (2.55 ±0.04) for consistent impedance
Very low loss (Df 0.0013 @ 10 GHz)
Excellent Passive Intermodulation (PIM) performance (-159/-163 dBc)
Very low moisture absorption (0.03%)
Very high copper peel strength (>13.6 lbs/in)
Available with standard ED or reverse-treated ED copper foil options
UL 94 V-0 flammability rating


Rogers AD255C Laminate


Typical Properties: AD255C

Properties Typical Value Units Test Conditions Test Method
Electrical Properties
Dielectric Constant (process)2.55-23°C @ 50% RH, 10 GHzIPC TM-650 2.5.5.5
Dielectric Constant (design)2.60-C-24/23/50, 10 GHzMicrostrip Differential Phase Length
Dissipation Factor0.0013-23°C @ 50% RH, 10 GHzIPC TM-650 2.5.5.5
Thermal Coefficient of Dk-110ppm/°C0 to 100°C, 10 GHzIPC TM-650 2.5.5.5
Volume Resistivity7.4 x 10⁸MΩ·cmC96/35/90IPC TM-650 2.5.17.1
Surface Resistivity3.6 x 10⁷C96/35/90IPC TM-650 2.5.17.1
Electrical Strength911V/mil-IPC TM-650 2.5.6.2
Dielectric Breakdown>40kVD-48/50, X/Y directionIPC TM-650 2.5.6
PIM²-159 / -163dBcReflected 43 dBm swept tones at 1900 MHz S1/S1Rogers Internal 50 ohm
Thermal Properties
Decomposition Temperature (Td)>500°C2hrs @ 105°C, 5% Weight LossIPC TM-650 2.3.40
CTE - x34ppm/°C-55°C to 288°CIPC TM-650 2.4.41
CTE - y26ppm/°C-55°C to 288°CIPC TM-650 2.4.41
CTE - z196ppm/°C-55°C to 288°CIPC TM-650 2.4.41
Thermal Conductivity0.35W/(m·K)z directionASTM D5470
Time to Delamination>60minutesas-received, 288°CIPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength2.4 (13.6)N/mm (lbs/in)10s @ 288°C, 35 μm foilIPC TM-650 2.4.8
Flexural Strength (MD/CMD)60.7 / 44.1 (8.8 / 6.4)MPa (ksi)25°C ± 3°CASTM D790
Tensile Strength (MD, CMD)55.8 / 45.5 (8.1 / 6.6)MPa (ksi)23°C @ 50% RHASTM D3039/D3039-14
Flex Modulus6,412 / 5,640 (930 / 818)MPa (ksi)25°C ± 3°CIPC-TM-650 2.4.4
Dimensional Stability (MD, CMD)0.03 / 0.07mils/inchafter etch + bakeIPC-TM-650 2.4.39a
Physical Properties
FlammabilityV-0--UL 94
Moisture Absorption0.03%E1/105 + D48/50IPC TM-650 2.6.2.1
Density2.28g/cm³C24/23/50ASTM D792
Specific Heat Capacity0.813J/g·°K2 hours at 105°CASTM E2716

Application Areas

Specifically engineered for today's wireless antenna markets. Ideal for antenna applications requiring high performance, low loss, and excellent PIM characteristics including:

Base Station Antennas
Passive Components (mixers, splitters, filters, combiners)
Feed Networks
RF Identification Tags
Radar systems
Mobile communications infrastructure


Available Configurations

Standard Thicknesses:
0.020" (0.508 mm) +/- 0.002"
0.030" (0.762 mm) +/- 0.002"
0.040" (1.016 mm) +/- 0.002"
0.060" (1.524 mm) +/- 0.002"
0.125" (3.175 mm) +/- 0.006"

Standard Panel Sizes:
For 0.020": 18" x 12" (457mm x 305mm), 18" x 24" (457mm x 610mm)
For all other thicknesses: 12" x 18" (305 x 457 mm), 24" x 18" (610 x 457 mm)

Standard Claddings:
Electrodeposited Copper Foil: ½ oz. (18µm), 1 oz. (35µm)
Reverse Treated Electrodeposited Copper Foil: ½ oz. (18µm), 1 oz. (35µm)

Contact Customer Service or Sales Engineering for other available product configurations including additional thicknesses, panel sizes and claddings.


 

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